Andrew Feldman, co-founder and CEO of Cerebras explains the 3 major supply-chain bottlenecks affecting much of the AI accelerator industry:

HBM memory, CoWoS packaging capacity, and access to TSMC’s 3nm manufacturing. Cerebras largely sidesteps all 3 by architectural choice.

It does not rely on HBM or CoWoS, and its current chips are manufactured on a 5nm process rather than 3nm.

In an industry where access to memory, advanced packaging, and leading-edge fabrication capacity can directly constrain shipments, that gives Cerebras a materially different supply profile from the main-street GPU systems.

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full video on The MAD Podcast with Matt Turck and Cerebras YouTube channel, (link in comment)