AI 导读
在机架内部，芯片之间完全按照当今 3D torus 的方式通过短距离铜线连接。每颗芯片的另外 6 个邻居位于六个相邻机架中的相同位置，而机架网格本身构成第二个 3D torus，通过光学拼接在一起。(6/8)
正文
Inside the rack, chips wire up exactly as in today's 3D torus, over short copper. Each chip's other 6 neighbors sit at the same position in the six adjacent racks, and the rack grid itself forms a second 3D torus, stitched together in optics. (6/8)
来源：@SemiAnalysis_ · x.com