AI 导读
华虹披露其无锡第三座12英寸晶圆厂获得国资背景资金，项目融资总额达42亿美元。Fab 9B 每月将新增5.5万片晶圆产能，生产电源管理、微控制器和数据中心用特殊工艺芯片，合作方包括中国“大基金”旗下主体。华虹二季度产线利用率达103%，营收创纪录7.175亿美元，净利润增长385.9%至3860万美元。
正文
Hua Hong, China’s second-largest contract chipmaker, disclosed state-backed funding Tuesday for its third 12-inch Wuxi fab, bringing project funding to US$4.2B.
Fab 9B will add 55,000 wafers per month, producing speciality chips for power management, microcontrollers and data centres. Partners include a vehicle of China’s “Big Fund.”
Fabs hit 103% utilisation in Q2. Revenue reached a record US$717.5M; net profit jumped 385.9% to US$38.6M. AI demand is lifting speciality chips too.
来源：@thexpin · x.com