SemiAnalysis 指出,随着加速器封装变大变复杂,ABF 载板产能已成为供应链关键约束。载板需求在数量与单颗用量两个维度同时增长:载板尺寸从 Hopper 的约 58x55mm 增至 Blackwell 的 82x75mm、Rubin 的约 95x98mm,增层数也从约 10-14 层提升到 24 层以上,供应商路线图上还有更复杂设计。
Take ABF substrates, for example.
As accelerator packages have grown larger and more complex, substrate capacity has emerged as a key constraint in the supply chain. Substrate demand is increasing along two dimensions:
More units and substantially more content per unit. Substrate bodies have grown from roughly 58x55mm on Hopper to 82x75mm on Blackwell and ~95x98mm on Rubin.
Build-up layers have moved from ~10-14 to 24+, with even more complex designs on supplier roadmaps.
But identifying the substrate makers is only the second step.
The next question is what those companies and technologies are enabling for expanding substrate capacity? (2/7)
来源:@SemiAnalysis_ · x.com