AI 导读
去规格化（despec）将 HBM 成本降低超过 50%——即便已计入 2026 年 HBM 涨价——并将内存占总资本成本的比例从约 40% 降至约 28%。 但这笔支出并未消失，而是转向了 scale-up 网络：在 NVL576 NPO SKU 上，随着光模块接管机架间互连，scale-up 占机架支出的比例从 4% 增至 12%，翻了三倍。(2/3)
正文
The despec cuts HBM cost by >50% — even with the 2026 HBM price hike already baked in — and takes memory from ~40% to ~28% of total capital cost.
But that spend doesn't vanish. It's redirected into scale-up networking: on the NVL576 NPO SKU, scale-up triples from 4% to 12% of rack spend as optics take over rack-to-rack interconnect. (2/3)
来源：@SemiAnalysis_ · x.com