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Rohan Paul· @rohanpaul_ai · X·· 1 小时前精选AI 评分68
AI 导读

WSJ 报道,Broadcom 正为 OpenAI 自研芯片洽谈逾 500 亿美元融资,Apollo 和 Blackstone 参与其中,目标 2026 年底前敲定。

推荐理由

报道披露了 OpenAI 自研芯片计划的融资规模和内部代号,可帮助读者了解 AI 算力扩张背后的债务结构。

正文

WSJ: Broadcom is trying to arrange more than $50B in financing for OpenAI's custom chips, with Apollo and Blackstone among the lenders and a close targeted before the end of 2026.

That money could cover several gigawatts of the 10 gigawatts OpenAI and Broadcom plan to deploy through 2029, under an internal chip program called Nexus whose first 2 generations are named Jalapeño and Serrano.

Oracle is negotiating with Apollo and Goldman Sachs over a lease structure in which investors fund a separate company that buys the chips, so Oracle can pay as cloud revenue arrives without borrowing more itself.

来源:Rohan Paul · x.com