AI 导读
阿里巴巴 CEO 吴泳铭(Eddie Wu)表示,旗下半导体公司平头哥(T-Head)的第二代自研 AI 芯片预计于 2026 年下半年流片并量产,该芯片在算力和互联带宽上有明显提升,阿里认为其可支撑大规模 AI 模型训练。
正文
Alibaba Group CEO Eddie Wu said its semiconductor unit T-Head expects its second-generation domestic AI chip to enter tape-out and production in H2 2026. The chip is designed with significantly improved computing power and interconnect bandwidth, and Alibaba believes it can support large-scale AI model training.
Alibaba Cloud has already launched the Zhenwu M890 AI supernode, which has served more than 650 customers. T-Head has shipped 560,000 AI chips across 20+ industries.
Alibaba is also integrating Cloud and T-Head into a new AI Cloud & Computing Services unit to strengthen its full-stack AI infrastructure.
来源:@thexpin · x.com