AI 导读
SemiAnalysis 的 Foundry Model 显示,2022 年二季度至 2026 年二季度,台积电晶圆收入份额大幅提升,出货量份额基本持平,与 UMC、GlobalFoundries、三星的晶圆 ASP 差距持续拉大。台积电混合 ASP 创新高,多数同行仍低于此前峰值。向高价值节点迁移推高其混合 ASP,使收入增速快于晶圆出货量。
正文
TSMC’s wafer ASP gap with UMC, GlobalFoundries and Samsung keeps widening. TSMC is setting new blended ASP highs while most peers remain below their previous peaks. Per our Foundry Model, from 2Q22 to 2Q26, TSMC’s wafer revenue share expanded sharply while its shipment share remained broadly stable, widening its blended ASP premium. Migration toward higher-value nodes increases TSMC’s blended ASP, allowing revenue to grow faster than wafer shipments. Technology leadership is translating into more revenue per wafer.
来源:SemiAnalysis · x.com