AI 导读
小米于8月24日发布玄戒O3芯片——消息称其可能采用台积电3nm工艺。同时发布的还有：面向端侧AI和汽车的O100与D100芯片，以及面向本地LLM的小米AI Cube“Prototype”迷你主机。 O3是小米10年芯片战略的支柱，将为小米18 Fold提供更强的AI算力。它搭配CXMT的LPDDR6——首款用于旗舰处理器的中国产LPDDR6，追赶SK Hynix和美光。 小米18 Fold预计出货量：20万–30万台。
正文
Xiaomi unveiled the Xuanjie O3 chip on Aug 24 — sources say it may use TSMC's 3nm process. Also launched: O100 & D100 chips for on-device AI and automotive, and the Xiaomi AI Cube "Prototype" mini-PC for local LLMs.
The O3 anchors Xiaomi's 10-year chip strategy and will power the Xiaomi 18 Fold with stronger AI compute. It pairs with CXMT's LPDDR6 — the first Chinese-made LPDDR6 in a flagship processor, chasing SK Hynix and Micron.
Xiaomi 18 Fold estimated shipments: 200k–300k units.
来源：@thexpin · x.com