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@EpochAIResearch· @EpochAIResearch · X·· 2026-09-05AI 评分49
AI 导读

如果华为无法在芯片性能上匹敌Nvidia,能否通过生产更多芯片来弥补?几乎不可能。华为当前的瓶颈不在逻辑芯片。中芯国际已经能够制造出比中国能封装成成品芯片更多的昇腾裸片。真正的瓶颈是高带宽内存(HBM),即为每颗AI芯片供数的堆叠内存。

正文

If Huawei cannot match Nvidia’s chip performance, could it compensate by producing more chips? Almost certainly not. Huawei's immediate constraint isn't logic. SMIC can already fab more Ascend dies than China can turn into finished chips. The bottleneck is high-bandwidth memory (HBM), the stacked memory that feeds every AI chip.

来源:@EpochAIResearch · x.com