AI 导读
突发：韩国韩美半导体已获得一份协议，为Terafab的AI芯片生产线提供先进封装设备。 这是首家加入该供应链的韩国后道设备制造商，此前HPSP于6月获得了前道设备订单。https://t.co/7lZM5rCSUJ
正文
BREAKING: South Korea’s Hanmi Semiconductor has secured a deal to provide advanced packaging equipment for Terafab’s AI chip production line.
It is the first Korean back-end equipment maker to join the supply chain, following HPSP’s front-end equipment order in June. https://t.co/7lZM5rCSUJ
来源：@cb_doge · x.com