AI 导读
存储供应商终于开始承认我们对 HBM 去规格化的判断。SK Hynix 公开表示 16-hi 很难做，市场现在正优先考虑带宽而非容量。混合键合在 HBM 中的理由一直是堆叠高度，而在 4-hi 和 8-hi 下并不存在需要解决的高度问题。用于 HBM 的 D2W 混合键合已经从"何时"的问题变成了"是否"的问题。(1/3)🧵
正文
Memory suppliers are finally acknowledging our HBM de-spec call. SK Hynix publicly said 16-hi is difficult, and the market is now prioritizing bandwidth over capacity. Hybrid bonding’s case in HBM was always stack height, and at 4-hi and 8-hi there is no height problem to solve. D2W hybrid bonding for HBM has gone from a question of when to a question of if. (1/3)🧵
来源：SemiAnalysis · x.com